Ic packaging substrate energy storage

Which organic materials are used in IC Advanced Packaging?

In this paper, the author introduced the application of organic materials including photoresist (PR), photosensitive polyimide (PSPI), underfill, epoxy molding compound (EMC), temporary bonding adhesive, high temperature bonding adhesive, dry film and the printing ink used in IC advanced packaging, as showed in Fig. 1.

Why do IC packaging materials need a better electrical performance?

With the increasing requirement for the operating speed of semiconductor products, IC packaging materials need to have better electrical performance, such as organic packaging materials with low dielectric constant (permittivity) and dielectric loss (dielectric loss) .

What is a substrate in packaging semiconductor?

A substrate in semiconductor packaging refers to the base material that provides structural support and electrical connectivity for the semiconductor die. It serves as the foundation on which the semiconductor chip is mounted and connected to the external circuitry.

What is IC substrate technology?

The substrate technology has evolved from early on lead frame, wire-bonding Ball Grade Array (BGA), and Chip Scale Packaging (CSP) to Flip Chip (FC) BGA, FCCSP, and even more advanced technologies such as CoWoS, Embedded Die in IC substrate, etc. Today, information forms the foundation of our connected world.

Which EMC material is used in IC packaging?

For IC advanced packaging technology such as ball grid array (BGA), embedded wafer level package (eWLP), FOWLP, system in package (SiP) and FOPLP, the used EMC material usually required with low warping, low expansion, high filling and high thermal conductivity. Fig. 8. The architecture of EMC used in IC packaging. 2.5.

What are IC packaging technologies?

To meet the multifunctionality of integrated circuit performance and the diversified requirement of products, the new IC packaging technologies such as 3D-IC, system level packaging and heterogeneous integration have been continuously developed [41, 42].